Release Compound

A concentrated silicone release, water-based agent for use in mold applications operating at temperatures from 60 °C – 260 °C (140 °F – 500 °F) without sticking, spotting, or marking.

Literatura y hojas de datos.

  • Product Advantages
  • Parámetros de características
  • Vista de instalación
Multiple releases from one application
Can be atomized for production use
Eliminates release agent build up on the mold
Características del Producto Aplicaciones
No organic solvents, Freons™ (CFC’s), or Halogenated compounds
No mold build up
Enhanced worker safety
Faster cycling

Molding methods
Die castings
Blow molding
Investment castings
Sand core operations

Tamaños de recipientes disponibles: 20 l